A CMOS-based chip that integrates silicon quantum dots and multiplexed readout electronics
Microscopy photo of chip with bond wires. Credit: Ruffino et al. Researchers at École Polytechnique Fédérale de Lausanne (EPFL) and ...
Read moreMicroscopy photo of chip with bond wires. Credit: Ruffino et al. Researchers at École Polytechnique Fédérale de Lausanne (EPFL) and ...
Read moreCredit: ISSCC 2021 Scientists at Tokyo Institute of Technology (Tokyo Tech) and NTT Corporation (NTT) have developed a novel CMOS-based ...
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